Baijun Machinery specializes in hot pressing equipment, precision stamping equipment, and powder forming equipment.
Product Description
Application Analysis of Multi-Layer Hot Press Molding in the Electrical and Electronics Field
1. Major Composite Materials Products in the Electrical and Electronics Field
The electronics and electrical sector is a key market for composite material applications, particularly in areas such as 5G communications, smart wearables, and consumer electronics, where demand is rapidly growing for lightweight, high-strength composites with excellent signal penetration capabilities.
Products in the electrical and electronics field that primarily utilize carbon fiber and glass fiber composites include:
5G communication equipment components:
- 5G phone back cover: Leveraging the lightweight, high-strength, and signal-penetrating advantages of carbon fiber composite materials.
- 5G base station antenna radome: Must feature excellent electromagnetic wave penetration and weather resistance.
- Communication equipment enclosure: Requires lightweight, high strength, and a certain level of electromagnetic shielding performance.
Smart wearable devices:
- VR/AR device casings: Pursuing lightweight design, high strength, and comfort.
- Smartwatch and wristband structural components: require lightweight, high-strength materials.
- Rigid support structures for wearable devices: leveraging the high specific strength of carbon fiber.
Consumer electronics:
- Tablet backplate: Made from carbon fiber or glass fiber composite materials to achieve lightweight design and high strength.
- Laptop casing/base cover: Requires a material that is lightweight, high-strength, and offers excellent heat dissipation.
- TWS earphone back cover: Leveraging the lightweight, high-strength, and signal-penetrating properties of fiberglass panels.
Other electronic components:
- Circuit board substrate: Requires a composite material with excellent insulation properties and dimensional stability.
- Internal support structure for electronic devices: Leveraging the lightweight and high-strength properties of composite materials.
- E-cigarette body: Designed for lightweight construction, high strength, and sleek aesthetics.
2. Characteristics of Multi-layer Hot-Pressing Technology for Electronic and Electrical Products
Composite material products in the electronics and electrical fields are typically thin-walled structures, demanding high precision in dimensions, superior surface quality, and excellent signal penetration. Their multi-layer hot-pressing molding process has the following characteristics:
Temperature control requirements:
- Lower curing temperature: Typically between 120–200°C to prevent damage to electronic components.
- Precise temperature control: Temperature fluctuations must be kept within a narrow range, typically ±1–2°C, to ensure consistent material properties.
- Rapid temperature control requirements: To enhance production efficiency, equipment often needs to have the ability to quickly heat up and cool down.
Pressure control requirements:
- Moderate molding pressure: Typically ranges from 1 to 10 MPa (equivalent to approximately 10 to 100 tons of force), depending on the material and product design.
- Uniform pressure distribution: Ensures even stress across all parts of the product, preventing deformation or uneven density.
- Multi-stage pressure control: A multi-step pressurization process may be required, involving low-pressure impregnation followed by high-pressure shaping.
Vacuum level requirements:
- High-vacuum environment: Typically, a vacuum level between 0.1 and 1 kPa (-0.1 to -0.095 MPa) is required to eliminate bubbles and enhance material density.
- Vacuum-assisted molding: Initiate vacuum during the pre-compression stage to reduce porosity and enhance product quality.
Characteristics of the molding cycle:
- Shorter molding cycles: Compared to industries like aerospace, the thermoforming cycle for electronic and electrical products is typically much shorter, usually ranging from 10 to 30 minutes.
- Suitable for mass production: The multi-layer hot-pressing molding process can meet the demands of large-scale manufacturing for electronic and electrical products.
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