Baijun Machinery specializes in hot pressing equipment, precision stamping equipment, and powder forming equipment.
Product Description
The high-temperature vacuum hot-pressing machine is a cutting-edge forming device integrating high-temperature heating, a high-vacuum environment, and high-pressure pressing, all coupled with precise control. By synergistically combining "high temperature + vacuum + pressure," it enables material densification, compounding, and the development of high-performance characteristics—making it widely used in advanced manufacturing fields such as ceramics, semiconductors, metal alloys, and composite materials. Its key features and applications are outlined below:
I. Core Features of the High-Temperature Vacuum Hot-Pressing Machine
1. High-Temperature Heating System: Precise temperature control, tailored to meet the needs of various materials
- Wide temperature range: Divided into two categories based on the application scenario—
- Medium-to-high temperatures (80–200°C): Used in consumer electronics and semiconductor packaging applications (such as carbon fiber molding for mobile phone back covers and ceramic substrate bonding), employing thermal oil or electric heating methods, with temperature uniformity maintained **within ±2°C** (References 2, 8, 10).
- Ultra-high temperatures (1500–1800°C): Used for ceramic sintering and heat treatment of metal alloys (e.g., aluminum nitride ceramic substrates, rare-earth alloys), employing resistance heating or induction heating to ensure materials reach sintering temperatures (Source 7).
- Multi-stage heating control: Supports segmented temperature ramp-up (e.g., "preheating - holding - curing"), with intelligent PID-based adjustment to maintain stable temperatures and prevent material defects caused by temperature fluctuations (References 3, 9, and 10).
2. High-vacuum environment: Eliminates impurities, ensuring material purity
- High vacuum level: Achieve a vacuum of 10⁻³ to 10⁻¹ Pa (for ceramic green sheet lamination) or **≤50 Pa** (for semiconductor electrostatic chucks), rapidly evacuating gases (such as air trapped in ceramic powders) and impurities from the materials. This prevents defects like oxidation and bubbles (References 4, 7, 8, 9).
- Vacuum efficiency: Some equipment can reach -70 mmHg (approximately 0.093 kPa) in as little as 10 seconds, significantly reducing process cycles (Sources 9 & 10).
3. Precise Parameter Control: Ultimate regulation for high-performance molding
- Pressure Control: Employs a servo closed-loop system, offering a pressure range of 20–500T (for consumer electronics) or 10–50 MPa (for ceramic sintering). Pressure fluctuations are maintained at **≤1%** within the 50–500T range, and multi-stage pressure settings are supported (e.g., "rapid pressurization – hold pressure – top-up pressure"), ensuring precise material compaction. (References 2, 3, 4, 8).
- Travel and Flatness: The upper and lower heating plates maintain a flatness of **±0.02 mm** and a parallelism of **±0.03 mm**. The guide posts are treated with high-frequency quenching, ensuring repeatable precision of **≤0.02 mm**, which guarantees uniform pressure distribution and prevents material warping (References 2, 3, 8, 9).
4. Automation and Intelligence: Enhancing Efficiency, Enabling Mass Production
- Automation Process: Supports fully automated loading and unloading (vibrating feeder + robotic arm feeding + material discharge), enabling a continuous "loading - compression molding - discharge" cycle while minimizing manual intervention (Document 5).
- Smart Control: Equipped with PLC program control, it supports manual, semi-automatic, and fully automatic modes. Key parameters—such as temperature, pressure, and vacuum level—are displayed in real time, and multiple process recipes can be saved. This system is ideal for producing diverse products in small batches (Refer to Materials 3, 5, 6, and 9).
5. Safety and Environmental Protection: Stable, reliable, and compliant with industrial standards
- Safety Protection: Equipped with multiple safety features such as overvoltage, overtemperature, and short-circuit protection. The heating system is enclosed in a stainless steel cover to prevent burns (Materials 1 & 3).
- Eco-friendly and energy-efficient: Vacuum technology reduces gas emissions, while servo-motor-driven oil pumps maintain pressure with zero energy consumption—resulting in over 30% energy savings compared to conventional equipment (Sources 1, 6, 9).
II. Main Application Areas of High-Temperature Vacuum Hot Pressing Machines
1. Ceramic Material Processing: A Core Application for High-Precision Molding
- Ceramic green tape lamination: Used in multilayer ceramic capacitors (MLCCs), this process stacks dozens of green tape layers with internal electrodes, followed by vacuum hot-pressing and co-firing to achieve high capacitance (≥100 μF) and miniaturization (≤0.4 mm × 0.2 mm) (Reference 8).
- Ceramic substrate sintering: Used for aluminum nitride (AlN) and alumina (Al₂O₃) substrates, this process involves high-temperature sintering at 1500–1800°C combined with high pressure ranging from 10 to 50 MPa, resulting in materials with exceptional thermal conductivity (AlN ≥ 180 W/m·K) and outstanding electrical insulation properties (≥ 10¹⁴ Ω·m). These substrates are ideal for heat dissipation in high-power electronic devices (Reference 7).
- Ceramic Electrostatic Chuck (ESC): Used in semiconductor lithography and etching machines, this device employs vacuum-assisted hot-pressing to form ceramic substrates, ensuring uniform temperature control during wafer processing—within ±1°C—and effectively preventing mechanical damage (refer to materials 4, 6, and 7).
2. Semiconductor Manufacturing: Key Equipment Supporting High-End Chips
- Ceramic substrate bonding: Used for power devices (such as IGBTs), this process involves thermally pressing copper foil onto the ceramic substrate to achieve a low void rate (<3%) and significantly enhance thermal performance (Reference 7).
- Semiconductor Packaging: Used in electrostatic chucks, this process leverages a high-temperature vacuum environment to bond carbon fiber with resin, enhancing the chuck's lightweight design—40% lighter than metal—and its superior corrosion resistance (referenced in Materials 6 and 7).
3. Metals and Alloys: Essential Tools for High-Temperature Heat Treatment
- Metal Powder Metallurgy: Used for rare-earth alloys and metal-ceramic composites, this process involves sintering in a high-temperature vacuum environment to inhibit grain growth, thereby enhancing material density (over 98%) and improving mechanical properties (Source 1).
- Superhard materials: Used in synthetic diamonds and PCD tools, these materials achieve a strong bond between diamond particles and the substrate under **high-temperature (>1000°C) + high-pressure (>5 GPa)** vacuum conditions (Source 1).
4. Composite Materials: The Preferred Choice for Molding Lightweight Products
- Carbon Fiber Reinforced Polymer (CFRP): Used in 2.5D back covers for smartphones and VR/AR helmets, this material is molded under high pressure—500 tons—at a temperature of 200°C after pre-impregnated layers have been carefully layered. This process results in lightweight components (60% lighter than metal) and exceptional strength (≥3000 MPa). (Sources 3 & 10)
- Carbon-based composite materials: Used in silicon carbide (SiC) and graphene applications, these materials achieve directional alignment via vacuum hot pressing, significantly enhancing thermal conductivity (≥500 W/m·K). They are ideal for thermal management in next-generation energy storage batteries (Sources 1 & 7).
5. New Energy and Consumer Electronics: Expanding Applications in Emerging Fields
- New energy materials—used in lithium-ion battery electrodes and fuel cell membranes—are processed under high-temperature, vacuum conditions to enhance their ionic conductivity and extend cycle life (Source 1).
- Consumer Electronics: Used for TWS earphone back covers and tablet rear casings, this solution leverages a quick die-change system (5–10 minutes) to accommodate production of multiple models, achieving high surface finish quality (Ra ≤ 0.8 μm). (Materials 3 & 10).
3. Summary
The core value of the high-temperature vacuum hot-pressing machine lies in achieving high-performance material forming through the combination of "high temperature + vacuum + precise control." Its distinctive features—such as "high-temperature adaptability, ultra-high vacuum purity, and advanced precision control"—make it an indispensable piece of equipment in cutting-edge manufacturing fields like ceramics, semiconductors, and composite materials. As the new energy and semiconductor industries continue to grow, this equipment will further evolve toward AI-driven process optimization (including machine learning-based parameter adjustments) and digital twin technology (enabling virtual debugging), thereby supporting the development of even more high-end products and accelerating the industry’s transition toward higher sophistication and intelligent innovation.
Main performance and features of the equipment:
a. High vacuum level, reaching up to 0.99 vacuum degree;
b. Maximum temperature: 3001°C–5001°C;
c. High temperature control accuracy of ±1°C;
d. The temperature difference across the hot plate can be as low as ±5°C at best;
e. The hot plate can achieve a flatness accuracy as high as ±0.03 mm;
f. Multi-stage pressure control, with each pressure stage having a separately set holding time;
g. Multiple venting function;
h. Multi-stage temperature control;
I. Scheduled Heating Function;
j. Menu-based save/restore functionality for product production data;
k. Three-stage pneumatic inflation function;
1. 1000-second ultra-long holding pressure function;
c. Heating methods: Optional electric heating tube heating or mold temperature controller heating;
d. Cooling method: Can be connected to a cooling tower or an ice water machine
Modular design: Customizable from 2 to 10 layers;
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